(page 11)
INTRODUCTION
OVERVIEW
For more than four decades, the semiconductor industry has distinguished itself by the rapid pace of improvement in its products.
The ITRS is a dynamic process, evident by the evolution of the ITRS documents.
(page 12)
OVERALL ROADMAP PROCESS AND STRUCTURE
ROADMAPPING PROCESS
(page 13)
ROADMAP CONTENT
The first situation, “Manufacturable solutions exist, and are being optimized,” indicates that the target is achievable with the currently available technology and tools, at production-worthy cost and performance
Red” indicates where there are no “known manufacturable solutions” (of reasonable confidence) to continued scaling in some aspect of the semiconductor technology.
(page 14)
TECHNOLOGY CHARACTERISTICS
As mentioned above, a central part of the IRC guidance and coordination is provided through the initial creation (as well as continued updating) of a set of Overall Roadmap Technology Characteristics tables
(page 15)
However, we are now in an era in which there are multiple significant drivers of scaling and believe that it would be misleading to continue with a single highlighted driver, including DRAM.
For example, along with half-pitch advancements, design factors have also rapidly advanced in Flash memory cell design, enabling additional acceleration of functional density.
Significant confusion relative to the historical ITRS node definition continues to be an issue in many press releases and other documents that have referred to “node acceleration” based on other, frequently undefined, criteria.
MEANING OF ITRS TIME OF INTRODUCTION
The ORTC and technology requirements tables are intended to indicate current best estimates of introduction time points for specific technology requirements.
(p 16)
For more explicit clarification, see Figure 2b, in which an example is shown for a new gate structure potential solution targeted for 2019 production
